Experimental and multiphysics simulation study of atoms migration and morphology evolution in solder joints under high current density

作者：Fei Jia, Leyi Niu, Yuchen Xi, Yuanying Qiu, Hongbo Ma, Chengpeng Yang · 发表于：International Journal of Heat and Mass Transfer · 年份：2022 · DOI：10.1016/j.ijheatmasstransfer.2022.123719 · 被引用次数：14 · 研究领域：Electronic Packaging and Soldering Technologies、Copper Interconnects and Reliability、Injection Molding Process and Properties