Magnetron sputtering preparation of Cu6Sn5 preferred-orientation coating and its influence on wettability of Sn-based lead-free solder

作者：Zhihang Zhang, Zhen Yang, Jiawei Qu, Yajia Liu, Jihua Huang, Shuhai Chen, Zheng Ye, Jian Yang · 发表于：Surface and Coatings Technology · 年份：2022 · DOI：10.1016/j.surfcoat.2022.129014 · 被引用次数：20 · 研究领域：Electronic Packaging and Soldering Technologies、Copper Interconnects and Reliability、3D IC and TSV technologies