A quantitative study of removal mechanism of copper polishing based on a single pad-asperity polishing test

作者：Ping Zhou, Haosong Shi, Lin Wang, Changyu Hou, Lei Meng, Hongyu Di, Dongming Guo · 发表于：International Journal of Mechanical Sciences · 年份：2022 · DOI：10.1016/j.ijmecsci.2022.107878 · 被引用次数：25 · 研究领域：Advanced Surface Polishing Techniques、Integrated Circuits and Semiconductor Failure Analysis、Semiconductor materials and devices