5-Amino-1,3,4-thiadiazole-2-thiol as a new leveler for blind holes copper electroplating: Theoretical calculation and electrochemical studies

作者：Miaomiao Zhou, Yachao Meng, Jingwei Ling, Yu Zhang, Wei Huang, Yulin Min, Xixun Shen, Qunjie Xu · 发表于：Applied Surface Science · 年份：2022 · DOI：10.1016/j.apsusc.2022.154871 · 被引用次数：55 · 研究领域：Electrodeposition and Electroless Coatings、Electronic Packaging and Soldering Technologies、Corrosion Behavior and Inhibition