Review of Nanocomposite Dielectric Materials With High Thermal Conductivity

作者：Manojkumar Lokanathan, Palash V. Acharya, A. Ouroua, Shannon Strank, Robert Hebner, Vaibhav Bahadur · 发表于：Proceedings of the IEEE · 年份：2021 · DOI：10.1109/jproc.2021.3085836 · 被引用次数：97 · 研究领域：Thermal properties of materials、Dielectric materials and actuators、Ferroelectric and Piezoelectric Materials

Dielectric materials with high thermal conductivity (TC) can enable disruptive performance enhancement in the areas of electronics packaging, thermal management, energy storage, cabling, and heat sinks. There have been widespread global efforts over the past decade on developing novel nanocomposite dielectric materials. As a baseline, legacy polymers and epoxies used in the abovementioned applications have very low thermal conductivities ranging from 0.1-0.5 W·m-1·K-1. Recent advances have led to the commercial availability of polymeric materials with thermal conductivities approaching 10 W·m-1·K-1. Importantly, several fundamental studies report novel nanocomposites with thermal conductivities > 50 W·m-1·K-1. This article summarizes progress in the development of such materials with a focus on developments that show promise for improved practical dielectrics. This review highlights that high TC alone is inadequate to characterize the suitability of any material for the above applications. Other thermal properties, such as thermal diffusivity, glass transition temperature, and the ratio of the in-plane to out-of-plane TC, are important to quantify the thermal performance of novel nanocomposites. In addition, characterization and understanding of mechanical properties (coefficient of thermal expansion (CTE), tensile strength and elastic modulus) and electrical properties (dielectric strength and dielectric permittivity) are critical for holistic multifunctional assessments of ...