3D Heterogeneous Package Integration of Air/Magnetic Core Inductor: 89%-Efficiency Buck Converter with Backside Power Delivery Network

作者：Xiao Sun, Hesheng Lin, Dimitrios Velenis, John Slabbekoorn, Giacomo Talmelli, Pieter Bex, Tom Sterken, Rudy Lauwereins, Christoph Adelmann, Andy Miller, Geert Van der Plas, Eric Beyne · 年份：2020 · DOI：10.1109/vlsitechnology18217.2020.9265045 · 被引用次数：7 · 研究领域：3D IC and TSV technologies、Electromagnetic Compatibility and Noise Suppression、Electronic Packaging and Soldering Technologies

We demonstrate a novel concept of integrating 110-μm. thick low-resistance high-Q magnetic core inductors in fan-out wafer level packaging (FOWLP). Unlike thin-film magnetic core inductors [1], this solution offers the possibility to embed thick cores to meet power density requirements, allowing for 89% efficiency at 1.2 W /mm2power density for 2: 1 power conversion with a backside power delivery network (BSPDN) using circular-shaped magnetic inductors.