Quinacridone skeleton as a promising efficient leveler for smooth and conformal copper electrodeposition

作者：Xiaomin Wang, Kang Wang, Jie Xu, Jun Li, Jinge Lv, Min Zhao, Limin Wang · 发表于：Dyes and Pigments · 年份：2020 · DOI：10.1016/j.dyepig.2020.108594 · 被引用次数：63 · 研究领域：Electrodeposition and Electroless Coatings、Molecular Junctions and Nanostructures、Copper Interconnects and Reliability