Location dependence of microstructure and mechanical properties of Cu–Al alloy fabricated by dual wire CMT

作者：Kun Liu, Xizhang Chen, Yupeng Zhang, Zengxi Pan, R. Arvind Singh, S. Jayalakshmi, С. В. Коновалов · 发表于：Materials Research Express · 年份：2019 · DOI：10.1088/2053-1591/ab583e · 被引用次数：14 · 研究领域：Microstructure and mechanical properties、Aluminum Alloys Composites Properties、Advanced materials and composites

Location dependence of microstructure and mechanical properties of Cu–Al alloy fabricated by dual wire CMT, Liu, Kun, Chen, Xizhang, Zhang, Yupeng, Pan, Zengxi, Singh, R Arvind, Jayalakshmi, S, Konovalov, Sergey