Development of Large Diameter Semi-Insulating Gallium Oxide (Ga2O3) Substrates

作者：John D. Blevins, K. T. Stevens, Adam C. Lindsey, Greg Foundos, Luke Sande · 发表于：IEEE Transactions on Semiconductor Manufacturing · 年份：2019 · DOI：10.1109/tsm.2019.2944526 · 被引用次数：112 · 研究领域：Ga2O3 and related materials、Advanced Photocatalysis Techniques、ZnO doping and properties

Beta-phase gallium oxide (β-Ga2O3) is an emerging ultra-wide bandgap semiconductor targeting next generation high power switching and high voltage RF electronics. β-Ga2O3possesses a bandgap (Eg) of approximately 4.9 eV and a theoretical critical field strength (Ec) of 8 MV/cm. The breakdown field for β-Ga2O3is 2 - 3 times larger than that of silicon carbide (SiC) or gallium nitride (GaN). The Baliga figure of merit for β-Ga2O3is at least three times GaN and eight times SiC making it a promising low-loss power switch material. Breakdown voltages of 1.6 kV and 740 V have been achieved for β-Ga2O3Schottky diodes and MOSFETs respectively. Lateral device electric fields of 3.8 MV/cm have also been demonstrated. Critical to this performance realization are the availability of native β-Ga2O3substrates. β-Ga2O3single crystals are produced by crystallization from a melt utilizing high growth rate processes such as Czochralski (CZ) or Edgedefined Film-fed Growth (EFG) techniques. Through Air Force Research Laboratory support, Northrop-Grumman SYNOPTICS has successfully scaled the growth of unintentionally doped (UID), Mg-doped and Fe-doped β-Ga2O3crystals from self-nucleated polycrystalline grains on iridium wire to seeded (010) oriented 50-mm diameter boules. Efforts directed at establishing growth and fabrication processes will be reviewed.