Technological performance of formaldehyde-free adhesive alternatives for particleboard industry

作者：Pia Solt, Johannes Konnerth, Wolfgang Gindl‐Altmutter, Wolfgang Kantner, Johann Moser, Roland Mitter, Hendrikus W. G. van Herwijnen · 发表于：International Journal of Adhesion and Adhesives · 年份：2019 · DOI：10.1016/j.ijadhadh.2019.04.007 · 被引用次数：268 · 研究领域：biodegradable polymer synthesis and properties、Lignin and Wood Chemistry、Nanocomposite Films for Food Packaging

Due to their high reactivity, chemical versatility and economic competitiveness, formaldehyde-based poly-condensation adhesives are used in huge amounts - in 2010 in the order of 20 million metric tons - around the globe, primarily in the wood-processing industry. Since the 1970s formaldehyde emissions from products made thereof came under pressure and were reduced continuously. The discussion intensified again initiated by the latest European CLP (classification, labelling and packaging) regulation, which came into force in 2016, classifying formaldehyde as a Carcinogen Category 1B compound. In view of potential and even stronger future restrictions of formaldehyde use, appropriate alternatives to substitute formaldehyde-based adhesive systems such as urea formaldehyde would have to be developed and implemented in the wood processing industry. The present review represents a critical appraisal of formaldehyde-free adhesive systems for particulate wood composites production proposed in literature so far. Adhesive systems analyzed here include both synthetic and renewable-based adhesives. The core of the review is an assessment of the individual adhesive systems based on selected technological (product and process) parameters relevant for wood-particleboard production. Based on this data we evaluated their potential to identify suitable alternative adhesives having a certain probability to meet the requirements of a large-scale processing industry sector. As an overall conclus...