Study on the Wear Characteristics of a Lapping Wheel in Double-Sided Lapping Based on the Trajectory Distribution

作者：Zhiyuan Lai, Zhongwei Hu, Congfu Fang, Zunhe xiao, PinHui Hsieh, Mingxin Chen · 发表于：IEEE Transactions on Semiconductor Manufacturing · 年份：2019 · DOI：10.1109/tsm.2019.2912454 · 被引用次数：18 · 研究领域：Advanced Surface Polishing Techniques、Advanced machining processes and optimization、Advanced Measurement and Metrology Techniques

In the process of double-sided lapping, the surface shape of the lapping wheel changes because of uneven wear, which affects the quality of the workpiece, especially the surface shape accuracy of the workpiece (bow, warp, and total thickness variance). Lapping trajectory is the primary reason for uneven wear on the wheel surface. Therefore, the uniformity of the lapping wheel wear during the double-sided lapping process will be investigated based on the trajectory distribution in this paper. First, the kinematics of double-sided lapping is analyzed, and the lapping trajectory equation is established. Then, the simulation calculation is conducted using MATLAB software to obtain the trajectory distribution characteristics of the wheel surface. The wear uniformity of the wheel surface is analyzed according to the distribution density of the trajectory. The wear model of the lapping wheel surface is established. Finally, double-sided lapping experiments with sapphire slices are carried out. Under varied workpiece material removal thicknesses, the changes of the lapping wheel surface profile are measured, and the wear of the lapping wheel surface along the radial direction is obtained and compared with the calculation results. The calculation results are basically consistent with the experimental results, which proves the correctness of the double-sided lapping wheel surface wear model.