Microstructure, IMCs layer and reliability of Sn-58Bi solder joint reinforced by Mo nanoparticles during thermal cycling

作者：Li Yang, Lu Zhu, Yaocheng Zhang, Shiyuan Zhou, Guoqiang Wang, Sai Shen, Xiaolong Shi · 发表于：Materials Characterization · 年份：2018 · DOI：10.1016/j.matchar.2018.12.012 · 被引用次数：77 · 研究领域：Electronic Packaging and Soldering Technologies、Intermetallics and Advanced Alloy Properties、Advanced Welding Techniques Analysis