The evolution of hardness in Cu-W alloy thin films

作者：Tianle Xie, Jiajun Zhu, Licai Fu, Ruiling Zhang, Na Li, Mengzhao Yang, Jiale Wang, Wen Qin, Wulin Yang, Deyi Li, Lingping Zhou · 发表于：Materials Science and Engineering A · 年份：2018 · DOI：10.1016/j.msea.2018.05.035 · 被引用次数：42 · 研究领域：Metal and Thin Film Mechanics、Copper Interconnects and Reliability、Microstructure and mechanical properties