Tough and Water‐Insensitive Self‐Healing Elastomer for Robust Electronic Skin

作者：Jiheong Kang, Donghee Son, Ging‐Ji Nathan Wang, Yuxin Liu, Jeffrey Lopez, Yeongin Kim, Jin Young Oh, Toru Katsumata, Jaewan Mun, Yeongjun Lee, Lihua Jin, Jeffrey B.‐H. Tok, Zhenan Bao · 发表于：Advanced Materials · 年份：2018 · DOI：10.1002/adma.201706846 · 被引用次数：1136 · 研究领域：Advanced Sensor and Energy Harvesting Materials、Polymer composites and self-healing、Conducting polymers and applications

Abstract An electronic (e‐) skin is expected to experience significant wear and tear over time. Therefore, self‐healing stretchable materials that are simultaneously soft and with high fracture energy, that is high tolerance of damage or small cracks without propagating, are essential requirements for the realization of robust e‐skin. However, previously reported elastomers and especially self‐healing polymers are mostly viscoelastic and lack high mechanical toughness. Here, a new class of polymeric material crosslinked through rationally designed multistrength hydrogen bonding interactions is reported. The resultant supramolecular network in polymer film realizes exceptional mechanical properties such as notch‐insensitive high stretchability (1200%), high toughness of 12 000 J m−2, and autonomous self‐healing even in artificial sweat. The tough self‐healing materials enable the wafer‐scale fabrication of robust and stretchable self‐healing e‐skin devices, which will provide new directions for future soft robotics and skin prosthetics.