Recent advances in TSV inductors for 3D IC technology

作者：Bruce Kim, Sang‐Bock Cho · 年份：2016 · DOI：10.1109/isocc.2016.7799702 · 被引用次数：5 · 研究领域：3D IC and TSV technologies、Semiconductor materials and devices、Radio Frequency Integrated Circuit Design

In this paper, we present a summary of 3D TSV inductors and their advances in RF applications. We describe a new inductor structure that uses fewer ground planes with the same functionality. Results were derived from a 3D full-wave simulation performed up to 2 GHz.