New Industrial series Transfer Mold MINI-DIPIPM with Integrated BSD and Temperature Measurement function

作者：Yazhe Wang, T. Tanaka, Toru Iwagami · 发表于：PCIM Europe 2014; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management; Proceedings of · 年份：2014 · 被引用次数：2 · 研究领域：3D IC and TSV technologies、Electrostatic Discharge in Electronics、Silicon Carbide Semiconductor Technologies

A new industrial series transfer mold type mini DIPIPM(exp TM) developed for applications like general inverter and servo for small capacity industrial motor drive or package air conditioner is presented in this paper. The new DIPIPM(exp TM) is designed to compatible with current mini DIPIPM(exp TM) Ver.3 and Ver.4 package outline, and taken external BSD (Bootstrap Diode) chips and temperature measurement function(eg. thermistor) inside to help realize cost down for inverter drive system by reducing peripheral electronic parts and PCB board size. By applying the VLD(Variation of Lateral Doping) structured 6.1th generation IGBT chip technology, both power loss and chip size are reduced compared with conventional mini DIPIPM(exp TM) products. And product line-up has extended to 50A current rating with the same package size (Fig.1), which used to be 30A in present line-up.