Effect of physical aging on dielectric, thermal and mechanical properties of cast-epoxy insulators

作者：Yiran Li, J. Unsworth · 发表于：IEEE Transactions on Dielectrics and Electrical Insulation · 年份：1994 · DOI：10.1109/94.300227 · 被引用次数：12 · 研究领域：High voltage insulation and dielectric phenomena、Epoxy Resin Curing Processes、Mechanical Behavior of Composites

Samples of cast bisphenol-A and cycloaliphatic epoxy insulation were quenched from a temperature above T/sub g/ (170/spl deg/C) to room temperature. Variations in dielectric, thermal and mechanical properties were examined during subsequent sub-T/sub g/ annealing (physical aging). It was found that the impact strength of the epoxy insulation decreased considerably with physical aging. Moisture intake and subsequent dielectric loss at room temperature were also found to decrease with physical aging. Glass transition temperature and excess enthalpy measured by DSC demonstrated significant increase with increased sub-T/sub g/ annealing. On the other hand, dielectric properties showed different changing patterns during sub-T/sub g/ annealing in different epoxy systems. It is concluded that epoxy insulating materials should be properly annealed before assessing their dielectric and other physical properties because of the possibility of unknown rapid cooling histories.>