Electron cyclotron resonance microwave discharges for etching and thin-film deposition

作者：Jes Asmussen · 发表于：Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 年份：1989 · DOI：10.1116/1.575815 · 被引用次数：365 · 研究领域：Plasma Diagnostics and Applications、Plasma Applications and Diagnostics、Gyrotron and Vacuum Electronics Research

A recent, important development in low-pressure and low-temperature plasma processing is the microwave electron cyclotron resonance (ECR) discharge. Its lack of electrodes and its ability to create high densities of charged and excited species at low pressures (≲10−4 Torr) make it an attractive processing discharge in etching and thin-film deposition applications. This article reviews the basic physics of ECR discharges and reviews the associated microwave system and applicator technologies. Waveguide and cavity ECR applicators are compared and are described in detail. Several ECR plasma processing reactors are also described. Methods of processing large surfaces are outlined, and typical experimentally measured ECR discharge characteristics are presented.