Corrosion behaviour of electrodeposited Ni–Sn–P alloys

作者：Hongzhi Wang, Yanbo Song, Ziyue Zhang, Suwei Yao, Weiguo Zhang · 发表于：Surface Engineering · 年份：2013 · DOI：10.1179/1743294412y.0000000079 · 被引用次数：12 · 研究领域：Electrodeposition and Electroless Coatings、Corrosion Behavior and Inhibition、Semiconductor materials and interfaces

Ni–Sn–P alloys with a stannous content of 2·91–4·05 wt-% and a phosphorous content of 13·54–14·56 wt-% produced as a coating on copper by constant current electrodeposition were studied, with regard to their corrosion behaviour upon immersion in 10 wt-% H 2 SO 4 solutions. The corrosion resistance of Ni–Sn–P alloy improved with increasing stannous content. X-ray photoelectron spectroscopy and energy dispersive X-ray spectroscopy confirmed the formation of Sn and P enriched layers at the alloy surface. After corrosion, a layer of passive film composed of SnO 2 , Ni(OH) 2 and Ni 3 (PO 4 ) 2 was formed on the surface, which could prevent the contact between metal surface and corrosive liquid.