Vibration characteristics of aluminum surface subjected to ultrasonic waves and their effect on wetting behavior of solder droplets

作者：Lin Ma, Zhiwu Xu, Kun Zheng, Jiuchun Yan, Shiqin Yang · 发表于：Ultrasonics · 年份：2013 · DOI：10.1016/j.ultras.2013.11.005 · 被引用次数：31 · 研究领域：Electronic Packaging and Soldering Technologies、Advanced Welding Techniques Analysis、Aluminum Alloy Microstructure Properties