Research on Vibration Stress Relief for Cured SU-8 Photoresist Layer

作者：Qun Feng Yang, Jian Zheng, Jun Qing Wang, Xue Nan Zhao, Da Yin Wei, Gaofeng Zheng · 发表于：Advanced materials research · 年份：2015 · DOI：10.4028/www.scientific.net/amr.1094.487 · 研究领域：Advanced Surface Polishing Techniques、Integrated Circuits and Semiconductor Failure Analysis、Metal and Thin Film Mechanics

The aim of this work is to reduce the residual stress in cured SU-8 Photoresist layer by vibration stress relief (VSR) method. The vibration device was designed according to the results of the ANSYS modal simulation, which was used for the thin film VSR. Meanwhile, some important influencing factors, such as the excitation current and the vibration time, have been discussed. The residual stress in the SU-8 layer was measured by profile method, and the values of residual stresses in the SU-8 layer before and after VSR were compared. The experimental results show that residual stress in SU-8 layer can be effectively eliminated or homogenized by VSR if the proper vibration parameters were chosen in the experiment.