Effects of pH values on electroless deposition of CoP films

作者：Ying Yu, M. G. Li, Guoying Wei, Hongliang Ge · 发表于：Surface Engineering · 年份：2013 · DOI：10.1179/1743294413y.0000000196 · 被引用次数：20 · 研究领域：Electrodeposition and Electroless Coatings、Electrocatalysts for Energy Conversion、Corrosion Behavior and Inhibition

CoP thin films were prepared on copper substrates from an alkaline bath by electroless deposition. Influences of pH values on deposition rates, compositions, structures, surface morphologies and magnetic performances of films were studied. Higher pH values could improve deposition rates and cobalt contents in the films. However, when the pH value is higher than 10, hydroxide depositions can result in the decrease of deposition rates and cobalt contents. Films prepared with different pH values show dissimilar surface morphologies. The films are densely covered with typical nodular structures when the pH value is equal to 10. However, films obtained with pH = 11 show agglomerate and rough structures. Phosphorus in the films would help to increase coercivity.