Thermo-mechanical Reliability Analysis of Copper TSV

作者：Sung‐Hoon Choa, Cha-Gyu Song · 发表于：Journal of Welding and Joining · 年份：2011 · DOI：10.5781/kwjs.2011.29.1.046 · 被引用次数：3 · 研究领域：3D IC and TSV technologies、Electronic Packaging and Soldering Technologies、Additive Manufacturing and 3D Printing Technologies

TSV technology raises several reliability concerns particularly caused by thermally induced stress. In traditional package, the thermo-mechanical failure mostly occurs as a result of the damage in the solder joint. In TSV technology, however, the driving failure may be TSV interconnects. In this study, the thermomechanical reliability of TSV technology is investigated using finite element method. Thermal stress and thermal fatigue phenomenon caused by repetitive temperature cycling are analyzed, and possible failure locations are discussed. In particular, the effects of via size, via pitch and bonding pad on thermo-mechanical reliability are investigated. The plastic strain generally increases with via size increases. Therefore, expected thermal fatigue life also increase as the via size decreases. However, the small via shows the higher von Mises stress. This means that smaller vias are not always safe despite their longer life expectancy. Therefore careful design consideration of via size and pitch is required for reliability improvement. Also the bonding pad design is important for enhancing the reliability of TSV structure.