Electrodeposition of Germanium

作者：György Székely · 发表于：Journal of The Electrochemical Society · 年份：1951 · DOI：10.1149/1.2778214 · 被引用次数：57 · 研究领域：Semiconductor materials and interfaces、Electrodeposition and Electroless Coatings、Molecular Junctions and Nanostructures

A process has been developed for electrodepositing a substantial layer of metallic germanium which adheres well. The plating bath is a solution of germanium tetrachloride in propylene glycol. It is conveniently operated at a temperature of 50°–60°C.