Interface stability and microstructure of an ultrathin α-Ta/graded Ta(N)/TaN multilayer diffusion barrier

作者：C. H. Liu, W. Liu, Y. H. Wang, Y. H. Wang, Y. Wang, Y. Wang, Zhu An, Zhong Xiao Song, Kewei Xu · 发表于：Microelectronic Engineering · 年份：2012 · DOI：10.1016/j.mee.2012.05.054 · 被引用次数：9 · 研究领域：Copper Interconnects and Reliability、Metal and Thin Film Mechanics、Semiconductor materials and devices