Copper electrodeposits in paper support

作者：D. Brynn Hibbert, J. R. Melrose · 发表于：Physical Review A · 年份：1988 · DOI：10.1103/physreva.38.1036 · 被引用次数：77 · 研究领域：Theoretical and Computational Physics、Material Dynamics and Properties、Electrodeposition and Electroless Coatings

Copper electrodeposits from an acid solution were grown, supported by laboratory filter paper. The paper provides good sample preservation and prevents convective solvent motion. Structural data from electron microscope and image analysis are reported. On decreasing the applied voltage, a transition from dense radial growth to open growth was observed. Values of the fractal dimension measured by image analysis for a series of growths were found in the range 2.0--1.7. The growths were often inhomogeneous and anisotropic, both on the microscopic and macroscopic scales. A number of growths were not fully characterized on the macroscopic scale by a single value to the fractal dimension. Wide variation in the microstructure of the growths was observed. On the micrometer scale, irregular microcrystalline, dendritic microcrystalline, and granular deposits were found. Copper surface densities were measured by x-ray microanalysis; fractal interpretations of observed scaling in these data were found to be unsatisfactory.