Thermoelectric air-cooling module for electronic devices

作者：Yu‐Wei Chang, Chih-Chung Chang, Ming-Tsun Ke, Sih‐Li Chen · 发表于：Applied Thermal Engineering · 年份：2009 · DOI：10.1016/j.applthermaleng.2009.01.004 · 被引用次数：164 · 研究领域：Advanced Thermoelectric Materials and Devices、Thermal Radiation and Cooling Technologies、Heat Transfer and Optimization