RF-TSV design, modeling and application for 3D multi-core computer systems

作者：Le Yu, Haigang Yang, Yuanlu Xie · 发表于：Journal of Electronics (China) · 年份：2012 · DOI：10.1007/s11767-012-0861-4 · 被引用次数：1 · 研究领域：3D IC and TSV technologies、Photonic and Optical Devices、Interconnection Networks and Systems