Blocking Inhibitors in Cathodic Leveling: I. Theoretical Analysis

作者：C. Madore, M. Matlosz, D. Landolt · 发表于：Journal of The Electrochemical Society · 年份：1996 · DOI：10.1149/1.1837318 · 被引用次数：94 · 研究领域：Non-Destructive Testing Techniques、Force Microscopy Techniques and Applications、Surface and Thin Film Phenomena

A model for predicting leveling during electrodeposition in the presence of an inhibiting additive is presented. Based on a diffusion‐adsorption mechanism, the model assumes that the additive is consumed at the cathode by electroreduction. Using the approximation of a flat, stagnant diffusion layer, leveling during metal electrodeposition into triangular and semicircular grooves is simulated. The variation of the leveling agent concentration along the groove profile is determined by solving a concentration field problem with a boundary element method, and the advancement of the groove profile is simulated with a flexible moving‐boundary algorithm. Leveling performance depends on three dimensionless groups characterizing leveling‐agent reduction, metal‐ion reduction, and the geometrical ratio of the diffusion layer thickness to the groove depth.