The Effect of Substrate Microstructure on the Heat-Affected Zone Size in Sn-Zn Alloys Due to Adjoining Ni-Al Reactive Multilayer Foil Reaction

作者：Ryan J. Hooper, David P. Adams, Deidre A. Hirschfeld, Michele V. Manuel · 发表于：Journal of Electronic Materials · 年份：2015 · DOI：10.1007/s11664-015-3941-z · 被引用次数：64 · 研究领域：Electronic Packaging and Soldering Technologies、Intermetallics and Advanced Alloy Properties、Solidification and crystal growth phenomena

The rapid release of energy from reactive multilayer foils can create extreme local temperature gradients near substrate materials. In order to fully exploit the potential of these materials, a better understanding of the interaction between the substrate or filler material and the foil is needed. Specifically, this work investigates how variations in local properties within the substrate (i.e. differences between properties in constituent phases) can affect heat transport into the substrate. This can affect the microstructural evolution observed within the substrate, which may affect the final joint properties. The effect of the initial substrate microstructure on microstructural evolution within the heat-affected zone is evaluated experimentally in two Sn-Zn alloys and numerical techniques are utilized to inform the analysis.