Statistical Analysis of Electrode Kinetics Measurements‐Copper Deposition from CuSO4 ‐ H 2 SO 4 Solutions

作者：Reinaldo Cabán, Thomas W. Chapman · 发表于：Journal of The Electrochemical Society · 年份：1977 · DOI：10.1149/1.2133656 · 被引用次数：65 · 研究领域：Electrochemical Analysis and Applications、Electrodeposition and Electroless Coatings、Corrosion Behavior and Inhibition

The kinetics of electrochemical copper deposition from copper sulfate‐sulfuric acid solutions have been studied by measuring polarization curves with a rotating‐disk electrode. Kinetics models are evaluated and their parameters determined by nonlinear regression analysis of 87 data points. The data are fit within experimental error by a five‐parameter model which includes the effects of both copper sulfate and sulfuric acid concentrations. The statistical analysis is made feasible by the rapid simulation of the experimental system by orthogonal collocation. The simulation involves computation of current distribution below limiting current at a specified applied potential for a given kinetics model.