A novel TSV inductor structure for RF applications

作者：Bruce Kim, Saikat Mondal, Sang‐Bock Cho, Jonathan Gamboa · 年份：2015 · DOI：10.1109/ectc.2015.7159598 · 被引用次数：10 · 研究领域：3D IC and TSV technologies、Radio Frequency Integrated Circuit Design、Microwave Engineering and Waveguides

In this paper, we present a positional analysis of a reference ground plane for Through-Silicon-Via (TSV)-based inductor implementation. A new inductor structure is proposed which uses fewer ground planes while still achieving the same functionality. Results were derived from a 3D full wave simulation performed up to 20 GHz.