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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
出版商：Japan Institute of Electronics Packaging · ISSN：1341-0571, 1884-1201 · 国家/地区：JP · 类型：journal · OA 开放获取
研究主题：Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Semiconductor Lasers and Optical Devices · Material Properties and Processing · Manufacturing Process and Optimization
数据覆盖：3 个公开学术数据源交叉核验（crossref、openalex、wikidata）。
数据来源与实体核验
核心指标
- h-index:6
- i10 指数:3
- 载文量 335 · 总被引 195
- Crossref DOI 总量:308
常见问题
《The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits》是开放获取(OA)期刊吗?
是,《The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits》是开放获取(Open Access)期刊。