HYBRIDS

出版商：Japan Institute of Electronics Packaging · ISSN：0914-2568, 1884-1171 · 国家/地区：JP · 类型：journal · OA 开放获取

研究主题：Legal and Regulatory Analysis · Linguistic, Cultural, and Literary Studies · Military Technology and Strategies · Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies

数据覆盖：3 个公开学术数据源交叉核验（crossref、openalex、wikidata）。