Shunfeng Han

发表论文 19 篇 · 总被引 19 次 · h-index 3

代表论文

• The Effect of BEOL Design Factors on the Thermal Reliability of Flip-Chip Chip-Scale Packaging (2025 · Micromachines · 被引 5)
• High Cu-Cu Bonding Strength Achievement Using Micron Copper Particles Under Formic Acid Atmosphere (2025 · Processes · 被引 3)
• Modeling and Simulation of Interconnection Structure Compensation Design in High-speed Modules (2021 · International Conference on Electronic Packaging Technology · 被引 3)
• The latest research status and prospect on microwave technology for monitoring concerned brain activity (2015 · 2015 IEEE International Conference on Mechatronics and Automation (ICMA) · 被引 3)
• Vertical Thermal Design and Modeling for Integrated Power Amplifier WBLGA SiP Packaging (2024 · International Conference on Electronic Packaging Technology · 被引 2)
• Effect of Chip Package Interaction on Cu/Ultralow-k Interconnect Fracture in Flip Chips (2024 · International Conference on Electronic Packaging Technology · 被引 2)