Kyungjune Son

发表论文 35 篇 · 总被引 309 次 · h-index 12

代表论文

Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme (2021 · IEEE Transactions on Components, Packaging, and Manufacturing Technology · 被引 39)
Policy-Based Reinforcement Learning for Through Silicon Via Array Design in High-Bandwidth Memory Considering Signal Integrity (2024 · IEEE transactions on electromagnetic compatibility (Print) · 被引 23)
Processing-in-memory in High Bandwidth Memory (PIM-HBM) Architecture with Energy-efficient and Low Latency Channels for High Bandwidth System (2019 · 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 被引 19)
Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer (2021 · IEEE transactions on electromagnetic compatibility (Print) · 被引 18)
Analysis of Repetitive Bending on Flexible Wireless Power Transfer (WPT) PCB Coils for Flexible Wearable Devices (2022 · IEEE Transactions on Components, Packaging, and Manufacturing Technology · 被引 17)
Reinforcement-Learning-Based Signal Integrity Optimization and Analysis of a Scalable 3-D X-Point Array Structure (2022 · IEEE Transactions on Components, Packaging, and Manufacturing Technology · 被引 15)