Jong Kyung Park

发表论文 7 篇 · 总被引 3 次 · h-index 1

代表论文

• Influence of deposition conditions on ALD based Ru passivation for Cu-Cu hybrid bonding (2025 · Scientific Reports · 被引 3)
• Research on the Crystallinity of Metal Passivation Layer for Improving Low-Temperature Copper Bonding Performance (2024 · Impact · 被引 1)
• A Gate-All-Around Back-Gated Junctionless 3D NAND Structure for Improved Switching Efficiency and Variability Suppression (2026 · International Memory Workshop)
• Machine Learning-Driven Modeling for Fast and Accurate Z-Interference Estimation in 3D NAND Scaling (2025 · IEEE Silicon Nanoelectronics Workshop)
• Optimizing Low-Temperature Polymer Thermo Compression Bonding and Polymer Patterning for 3D Multi-Chip Integration (2024 · Impact)
• Influence of Current Distribution Variations on Contact Resistance Measurement in Cu-Cu Bonding Interface (2024 · Impact)