Christian Belady

发表论文 5 篇 · 总被引 77 次 · h-index 4

代表论文

• Using life cycle assessment to drive innovation for sustainable cool clouds (2025 · Nature · 被引 55)
• Toward TSV-Compatible Microfluidic Cooling for 3D ICs (2025 · IEEE Transactions on Components, Packaging, and Manufacturing Technology · 被引 15)
• Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads (2024 · Journal of Electronic Packaging · 被引 14)
• Electrical–Thermal Co-Analysis of Through-Silicon Vias (TSVs) Integrated Within Micropin-Fin Heatsink for 3-D Heterogeneous Integration (HI) (2024 · IEEE Transactions on Components, Packaging, and Manufacturing Technology · 被引 12)
• Electrical-Thermal Co-analysis of TSV Embedded Microfluidic Pin-fin Heatsink for High Power Dissipation with High Bandwidth Density (2024 · Electronic Components and Technology Conference · 被引 5)