Baobin Yang

发表论文 5 篇 · 总被引 10 次 · h-index 2

代表论文

• The Effect of BEOL Design Factors on the Thermal Reliability of Flip-Chip Chip-Scale Packaging (2025 · Micromachines · 被引 5)
• High Cu-Cu Bonding Strength Achievement Using Micron Copper Particles Under Formic Acid Atmosphere (2025 · Processes · 被引 3)
• Vertical Thermal Design and Modeling for Integrated Power Amplifier WBLGA SiP Packaging (2024 · International Conference on Electronic Packaging Technology · 被引 2)
• Effect of Chip Package Interaction on Cu/Ultralow-k Interconnect Fracture in Flip Chips (2024 · International Conference on Electronic Packaging Technology · 被引 2)
• Optimization of Package Heat Dissipation Design Based on High-power WB-BGA Industrial Chip with a Wide Temperature Range (2023 · Journal of Physics, Conference Series · 被引 1)