Wei Shen

发表论文 15 篇 · 总被引 40 次 · h-index 4

代表论文

Study on polishing mechanisms of BEOL metal interconnects based on chemical and mechanical synergy (2025 · Microsystems & Nanoengineering · 被引 12)
Effect of Warpage on Solder Joint Fatigue Life by Influencing the Solder Joint Shape in BGA Packages (2024 · IEEE Transactions on Components, Packaging, and Manufacturing Technology · 被引 9)
Influence of phosphorus donor on the NV center: A first-principles study (2023 · Physica B: Condensed Matter · 被引 5)
Design Optimization of Gas Distribution System for Large‐Scale Capacity GaAs‐MOCVD (2023 · Crystal research and technology (1981) · 被引 4)
A Simplified Method for Analyzing PCB Warpage During Reflow: Focusing on Warpage Change and Initial Warpage Shape (2025 · IEEE Transactions on Components, Packaging, and Manufacturing Technology · 被引 3)
Research on deep trench capacitor structure design and its effect on capacitance density and breakdown voltage (2024 · International Conference on Electronic Packaging Technology · 被引 3)