B. Vermeersch

发表论文 14 篇 · 总被引 83 次 · h-index 5

代表论文

• Backside Power Delivery: Game Changer and Key Enabler of Advanced Logic Scaling and New STCO Opportunities (2023 · International Electron Devices Meeting · 被引 30)
• Multiscale Thermal Impact of BSPDN: SoC Hotspot Challenges and Partial Mitigation (2024 · International Electron Devices Meeting · 被引 19)
• Experimentally Validated Thermal Modeling Prediction for BEOL and BSPDN Stacks (2024 · Electronic Components and Technology Conference · 被引 14)
• Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC (2023 · IEEE Transactions on Very Large Scale Integration (vlsi) Systems · 被引 13)
• Thermal Modeling and Analysis of Equivalent Thermal Properties for Advanced BEOL Stacks (2025 · IEEE Transactions on Components, Packaging, and Manufacturing Technology · 被引 10)
• Experimental Thermal Characterization of Thin Film low-k Dielectric Materials (2024 · Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems · 被引 8)