Y. Mei

发表论文 155 篇 · 总被引 3039 次 · h-index 32

代表论文

Pressureless Sintered-Silver as Die Attachment for bonding Si and SiC Chips on Silver, Gold, Copper, and Nickel Metallization for Power Electronics Packaging: The Practice and Science (2022 · IEEE Journal of Emerging and Selected Topics in Power Electronics · 被引 32)
Packaging Design of 15 kV SiC Power Devices With High-Voltage Encapsulation (2022 · IEEE transactions on dielectrics and electrical insulation · 被引 28)
A Double-Sided Bidirectional Power Module With Low Heat Concentration and Low Thermomechanical Stress (2021 · IEEE transactions on power electronics · 被引 26)
Design and Analysis of a Self-Circulated Oil Cooling System Enclosed in Hollow Shafts for Axial-Flux PMSMs (2022 · IEEE Transactions on Vehicular Technology · 被引 24)
High thermal conductivity diamond-doped silver paste for power electronics packaging (2021 · Materials letters (General ed.) · 被引 21)
High-Temperature Characterizations of a Half-Bridge Wire-Bondless SiC MOSFET Module (2021 · IEEE Journal of the Electron Devices Society · 被引 20)