H. Simka

发表论文 20 篇 · 总被引 171 次 · h-index 7

代表论文

• Research Updates: The three M's (materials, metrology, and modeling) together pave the path to future nanoelectronic technologies (2013 · 被引 68)
• From Interconnect Materials and Processes to Chip Level Performance: Modeling and Design for Conventional and Exploratory Concepts (2020 · International Electron Devices Meeting · 被引 17)
• Extending Reaction Mechanism Generator to Silicon Hydride Chemistry (2016 · 被引 17)
• Density functional theory and beyond—opportunities for quantum methods in materials modeling semiconductor technology (2008 · Journal of Physics: Condensed Matter · 被引 17)
• Advanced interconnect challenges beyond 5nm and possible solutions (2021 · International Interconnect Technology Conference · 被引 11)
• Fundamentals of Cu/Barrier-Layer Adhesion in Microelectronic Processing (2005 · 被引 10)