Boyuan Cui

机构：Chinese University of Hong Kong · ORCID：0009-0006-4468-7280

发表论文 44 篇 · 总被引 208 次 · h-index 9

代表论文

Simulation and Analysis on Motion Behavior of Metal Particles in AC GIL (2022 · IEEE Transactions on Dielectrics and Electrical Insulation · 被引 27)
Multiport Current Injection Hybrid DC Circuit Breaker With Simple Bridge Arm Circuit (2022 · IEEE Transactions on Industrial Electronics · 被引 11)
Quantization Effects on Digital-PR-Controlled Active Power Filter (2023 · IEEE Journal of Emerging and Selected Topics in Power Electronics · 被引 8)
Ultrasonic Detection and Diagnostic Method for the Internal Defects in Epoxy Composite (2024 · IEEE Transactions on Dielectrics and Electrical Insulation · 被引 7)
Refine EEG Spectrogram Synthesized by Generative Adversarial Network for Improving The Prediction of Epileptic Seizures* (2023 · 被引 5)
Defect Detection and Recognition of Insulation Pull Rod Based on the Ultrasonic Method (2022 · 2022 IEEE 4th International Conference on Dielectrics (ICD) · 被引 5)