Wenchao Tian

机构：Xidian University, China XD Group (China)

发表论文 98 篇 · 总被引 2013 次 · h-index 18

代表论文

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review (2024 · Micromachines · 被引 48)
Research of Vertical via Based on Silicon, Ceramic and Glass (2023 · Micromachines · 被引 36)
Photonic Integrated Circuits: Research Advances and Challenges in Interconnection and Packaging Technologies (2025 · Photonics · 被引 28)
High-Frequency Transmission Characteristic Analysis of TSV-RDL Interconnects (2023 · IEEE Transactions on Components Packaging and Manufacturing Technology · 被引 27)
The Study of the Reliability of Complex Components during the Electromigration Process (2023 · Micromachines · 被引 22)
Structural insight into the multifunctionality of non-stoichiometric BNT ferroelectrics (2024 · Journal of Materials Chemistry A · 被引 20)