Packages Fan Zhang

机构：China University of Mining and Technology

发表论文 2 篇 · 总被引 72 次 · h-index 2

代表论文

• An investigation into the effects of flux residues on properties of underfill materials for flip chip packages (2003 · IEEE Transactions on Components and Packaging Technologies · 被引 60)
• Dynamic mechanical relaxation behavior of TiZrHfCu-Ni/Be/NiBe high-entropy metallic glasses (2023 · Intermetallics · 被引 12)