Hirose Suzuki

机构：Daicel (Japan)

发表论文 9 篇 · 总被引 33 次 · h-index 3

代表论文

Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate (2023 · Microelectronics Reliability · 被引 19)
Effects of high temperature and high humidity on the reliability of copper/epoxy bond (2024 · Applied Surface Science · 被引 7)
Copper diffusion into epoxy under high temperature (2024 · Materials Letters · 被引 4)
Self-assembled layer as an effective way to block copper diffusion into epoxy (2024 · Materials Letters · 被引 3)
Investigation of Degradation Behavior of Adhesion between Sealing Resin and Copper by Aging Treatment (2026 · Materials science forum)
Reliability Assessment of Cycloaliphatic Epoxy Encapsulation for Next-Generation Power Modules (2025)