Chao Gao

机构：State Grid Corporation of China (China), CRRC (China), Nanjing University · ORCID：0000-0002-5660-2524

发表论文 147 篇 · 总被引 767 次 · h-index 12

代表论文

Reliability analysis of PoP stacked solder joints under thermal cycling load based on the optimal equivalent model (2025 · Microelectronics Journal · 被引 9)
Stress analysis and optimization of QFN solder joints under bending-torsion coupled conditions based on the SSA (2025 · Microelectronics Journal · 被引 8)
Finite-Element Analysis and Multiobjective Optimization of Solder Joint Temperature Difference and Cooling Stress During PCBA Reflow Process (2025 · IEEE Transactions on Components Packaging and Manufacturing Technology · 被引 8)
Analysis and prediction of bending-torsion coupled stress in BGA stacked solder joints considering interaction effects (2025 · Microelectronics Journal · 被引 4)
Study on the optimization of bending-vibration coupling stress of QFN solder joints based on Taguchi orthogonal experimental design and Harris Hawks Optimization algorithm (2025 · Microelectronics Reliability · 被引 4)
Stress–strain analysis and prediction of WLCSP solder joints under bending–torsion coupled loading (2025 · Microelectronics Reliability · 被引 4)