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Le Li

机构:North China Electric Power University, Fairchild Semiconductor (United States) · ORCID:0000-0003-0567-0081

发表论文 94 篇 · 总被引 1402 次 · h-index 19

代表论文

  • Hierarchical design of microcapsules-based epoxy resin coating enhanced with Ti3C2Tx for improving thermal, tribological, anti-corrosive performance (2024 · Carbon · 被引 49)
  • High temperature resistant thin film thermocouple prepared based on inkjet printing (2024 · Ceramics International · 被引 24)
  • A new electrostatic dust removal method using carbon nanotubes transparent conductive film for sustainable operation of solar photovoltaic panels (2023 · Energy Conversion and Management · 被引 23)
  • Distinct photooxidation and interface degradation of waterborne epoxy resin coatings on mortar substrate affected by bulk water (2024 · Polymer Degradation and Stability · 被引 10)
  • Performance evaluation and correction of Al 2O 3 and YSZ-doped In 2O 3/In 2O 3 multilayer heterogeneous thin-film thermocouples up to 1850 °C (2025 · Journal of Advanced Ceramics · 被引 7)
  • High-entropy catalysts for electrocatalytic reduction reaction (2024 · Journal of Alloys and Compounds · 被引 7)