Mario González

机构：University of Utah · ORCID：0000-0003-4374-4854

发表论文 212 篇 · 总被引 3239 次 · h-index 27

代表论文

• Methodologies for Characterization of W2W Bonding Strength (2024 · 被引 12)
• Sustainability insights from Late Pleistocene climate change and horse migration patterns (2025 · Science · 被引 10)
• Simulations of Wafer-to-Wafer Bonding Dynamics and Deformation Mechanisms (2024 · 被引 10)
• Gate oxide reliability: upcoming trends, challenges, and opportunities (2024 · 被引 6)
• Mitigation of Wafer-To-Wafer Bonding Distortions Through Accelerated Simulations and Measurements (2025 · 被引 5)
• Predictive Modeling of Thin Film Yield Stress Using Machine Learning: A Simulation-Based Approach (2024 · 被引 5)